951 Sandisk Dr, Milpitas, CA On-site Full-time 147,710.00-244,674.00

Sandisk is hiring a Technologist, Packaging Engineering

We are seeking a detail-oriented and analytical Technologist, Packaging Engineering to join our team in Milpitas, United States. In this role, you will drive innovation in packaging solutions while ensuring efficiency, quality, and compliance across all product lines. You will collaborate with cross-functional teams to design, develop, and optimize packaging systems that meet customer requirements and regulatory standards. The ideal candidate will bring a systematic approach to problem-solving and a commitment to continuous improvement in packaging technology. ESSENTIAL DUTIES AND RESPONSIBILITIES: Serve as the senior Package Engineering representative on cross‑functional leadership teams, setting technical direction and ensuring packages are fully characterized, qualified, and released to production on schedule while meeting stringent mechanical, electrical, performance, reliability, and quality requirements. Provide end‑to‑end ownership of the package lifecycle across design, development, qualification, and manufacturing, driving alignment among cross‑functional engineering teams, global factories, and key stakeholders. Lead global engagement with factories and contract manufacturers to enable robust, scalable, and cost‑effective high‑volume introduction of new package designs and advanced assembly processes. Partner with Packaging R&D organizations worldwide to define, develop, and qualify next‑generation and emerging packaging technologies in alignment with long‑term business strategy and product roadmaps. Drive enterprise‑level assembly yield improvement initiatives and package cost‑duction programs, establishing best practices and measurable performance targets across supported product lines. Own package technology roadmaps, oversee budgets for supported products, and guide the development of scalable packaging infrastructure to support future growth and technology transitions. Lead new products through the transition from low‑volume to high‑volume manufacturing, ensuring yield, quality, and reliability objectives are achieved. Establish and enforce readiness of FMEA, SOD, Control Plans, process recipes, SPC, and other critical assembly controls prior to high‑volume production. Provide technical leadership in evaluating and validating design options through characterization builds and comprehensive DFX (Design for excellence) analyses, including DFM (Design for Manufacturability), DFA (Design for Assembly), DFRW (Design for Rework), influencing product architecture and manufacturing strategy at the system level.
Job Details
Location 951 Sandisk Dr, Milpitas, CA
Work mode On-site
Employment Full-time
Salary 147,710.00-244,674.00
Department Packaging Engineering
Category other
Posted 6 months ago
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Sandisk innovates in Flash and advanced memory technologies, delivering solutions that enable digital world needs with groundbreaking memory products recognized globally for performance and quality.
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