As a System IC Architect, you will lead the development of advanced Point of Load (PoL) power solutions for high-performance computing applications in AI and automotive systems. Your work will center on defining system-level architectures for power semiconductor modules and System-in-Package (SiP) technologies, ensuring alignment with evolving performance, size, and efficiency demands.
What You'll Do
You will define product concepts and technical specifications, translating customer and market requirements into innovative power management and packaging solutions. You'll develop long-term technology roadmaps in collaboration with product and R&D teams, focusing on advancements in power delivery for AI compute and 48V automotive electrification platforms.
Support engineering efforts through electrical and thermal analysis, driving optimization in high-density power systems. You'll lead integration of ICs and power devices into advanced packages, working closely with design, modeling, packaging, and manufacturing teams to validate and refine high-performance solutions.
Act as a technical interface with customers, enabling co-development and design-in activities. You'll also assess emerging power technologies, benchmark competitive offerings, and report progress on key performance indicators to senior leadership.
Requirements
- Deep expertise in Advanced Power Management, particularly for Point of Load (PoL) applications
- Proven experience in System-in-Package (SiP) integration and system-level power architecture
- Strong understanding of AI Compute Power Solutions
- Advanced degree in Power Electronics, Electrical Engineering, or related field—Ph.D. preferred
- Minimum of 15 years in power semiconductors, packaging, and system integration
- Track record from product definition through to revenue-generating solutions
- Strong technical foundation in thermal management, electrical performance, and reliability
- Experience powering high-performance SoCs, especially under automotive-grade requirements
- Familiarity with Functional Safety standards such as ISO26262 or IEC61508 is advantageous
- Experience leading global, cross-functional engineering teams
- Excellent communication skills and ability to collaborate across disciplines
- Proficiency with simulation tools including Cadence Spectre, PSPICE, HSPICE, Saber, Simetrix/Simplis, and Verilog-AMS
- Knowledge of PCB materials and stack-up design
- Willingness to travel internationally as needed
Benefits
This role offers a hybrid work model with flexible arrangements and location options. Compensation includes competitive salary, equity, and additional benefits tailored to support long-term career growth and technical innovation.
