At TE Connectivity, our mission is to create a safer, sustainable, and more connected world. We are hiring a Principal R&D/Product Development Engineer to lead our DDN socket team. In this role, you will define technical activities, create product standards, and directly influence the technology roadmap for high-speed socket products through close collaboration with customer innovators and global internal teams.
What You'll Do
- Develop innovative design concepts and conduct feasibility studies to assess technical and commercial viability.
- Collaborate with global Product Design Engineering (PDE) teams to accurately convert VOC and PRD into detailed design inputs.
- Create simplified 3D models and perform signal integrity (SI) simulations using advanced tools such as Ansys HFSS to validate electrical performance.
- Build and test prototype samples, execute design validation plans, and complete product qualification.
- Lead end-to-end product development of high-speed, fine-pitch, large-size sockets—from market definition to production release.
- Foster strong alignment between business and customer engineering teams to deepen market understanding.
- Mentor and train engineering teams in advanced mechanical design principles and signal integrity simulation methodologies.
- Collaborate closely with customers and internal stakeholders to capture clear Voice of Customer (VOC) and translate it into conceptual designs.
- Engage in early-stage pathfinding with customers to co-develop cutting-edge interconnect solutions.
- Prepare and present engineering evaluations and proposals to customers.
- Provide technical support to manufacturing and quality teams to ensure efficient ramp-up and safe product launches.
- Support cross-functional teams through DFMEA, testing, troubleshooting, and engineering analysis.
What We're Looking For
- Bachelor’s degree in Mechanical or Mechatronics Engineering.
- Minimum of 5 years of work experience in mechanical design for high-speed interconnect products.
- Direct customer design and support experience, including the ability to work with Field Application Engineers to troubleshoot problems.
- Understanding of semiconductor IC packaging and fundamental test/burn-in methodology.
- Expert-level knowledge of interconnect design or experience with high-speed connectors with PCIE Gen 6/7 compliance.
- High level of competency in mechanical design tools such as Creo/SolidWorks.
- Good level of competency in signal integrity analysis tools (Ansys HFSS, Keysight ADS).
- Strong analytical capabilities to interpret simulation and lab data, identify issues, and provide solutions.
- Excellent verbal and written communication skills.
- Ability to work in a global environment, fluent in English, and able to collaborate across geographies.
- Highly motivated, quick learner, and able to work independently.
Nice to Have
- Master’s degree preferred.
- High-speed signal integrity knowledge preferred.
- Design experience with high-speed servers, switches, and memory is a plus.
- Six Sigma methodologies or other strong data analytics background is a plus.
Technical Stack
- Creo
- SolidWorks
- Ansys HFSS
- Keysight ADS
Team & Environment
You will be part of the DDN socket team, collaborating with global Product Design Engineering (PDE) teams, business and customer engineering teams, Sales, System Architects, FAEs, PMs, and manufacturing sites.
TE Connectivity is an equal opportunity employer.
