NVIDIA is looking for an IC Senior Packaging Engineer to provide technical leadership for sophisticated IC substrates and ASIC packages within our Networking Business Unit. You will be responsible for driving development from concept through NPI and ramp, representing the packaging organization throughout the product lifecycle.

What You'll Do

Lead development of cutting-edge microelectronics packaging for future NVIDIA Networking products.
Evaluate product reliability and performance.
Review manufacturability readiness at each development milestone.
Work with world-leading vendors to develop highly challenging packaging solutions.
Join and lead task forces to investigate and support production excursions, failure analysis, and reliability issues.
Establish quality standards.
Monitor substrate and assembly production KPIs.
Collaborate with cross-functional teams to define and monitor Yield Improvement Plans.
Lead process change reviews and present data in Change Control Board meetings.
Lead technical reviews of product changes throughout the supply chain.
Partner with SI, package layout, and ASIC design teams.
Collaborate closely with suppliers and Operations.
Drive DFM, manufacturing feedback, and process optimization to strengthen supply robustness and quality.
Handle schedule planning and delivery management.
Own cost and risk.
Resolve packaging, manufacturing, and electrical design issues hands-on.

What We're Looking For

BSc in Mechanical/Materials Engineering (or related field) or equivalent experience.
5+ years of relevant experience in semiconductor packaging across development and manufacturing.
Basic design proficiency with 2D ArtiosCAD and 3D CAD (NX/SolidWorks/Creo).
DFM expertise; solid understanding of tooling design, manufacturing processes, material properties, and metrology tools.
Strong focus on quality, robustness, and manufacturability.
High self-learning and self-motivation; fosters continuous improvement with a proactive approach.
Leadership capability to drive cross-company, cross-functional projects across multiple locations.
Curious, creative problem solver; well organized and able to manage multiple priorities.
Strong English communication skills (verbal and written).

Nice to Have

Background at substrate manufacturing or assembly sites.
Background in engineering semiconductor manufacturing processes.
Experience in a manufacturing environment and with manufacturing statistics tools.
Hands-on mechanical FEA experience—ideally developing simulations in Ansys.
Proficiency with mechanical CAD (e.g., SolidWorks).
NPI leadership, including close collaboration with Operations on manufacturing and quality.
Proven ability to manage multiple packaging projects in cross-functional settings and teams.

Technical Stack

2D ArtiosCAD
3D CAD (NX/SolidWorks/Creo)
Ansys
Mechanical CAD (e.g., SolidWorks)

Team & Environment

You will report to NVIDIA Networking HQ in Israel, collaborating remotely with that team.

Work Mode

This is a local-country position based in Taiwan.

NVIDIA is an equal-opportunity employer that values diversity and inclusion. We do not discriminate on the basis of race, religion, color, national origin, gender, sexual orientation, age, marital status, veteran status, or disability status. We are dedicated to providing reasonable accommodations and adjustments to applicants with disabilities.