Microchip Technology Inc. is seeking an Engineer I-Failure Analysis to join our team. In this role, you will perform detailed electrical and physical failure analysis on advanced semiconductor products. You will work collaboratively with cross-functional teams and external laboratories to resolve failure analysis cases and contribute to the development of new analytical methods.
What You'll Do
- Perform detailed electrical and physical failure analysis using non-destructive tools like X-ray, Scanning Acoustic Microscope (SAM), and optical microscopes.
- Conduct electrical bench verification and interpret ATE datalog.
- Utilize fault isolation techniques including Photo Emission Microscopy (PEM), Thermal Emission/Hotspot Analysis, OBIRCH, and die level microprobing.
- Perform deliding and delayering via chemical/laser decapsulation, chemical etch, dry etch, and mechanical polishing.
- Perform SEM/EDX analysis.
- Collaborate with local and remote Failure Analysis engineers to develop techniques and capabilities.
- Work with cross-functional teams such as FA, CQE, Quality, Reliability, Applications, Design, Foundry, Test, Product Engineering, and Line Engineering to resolve FA cases.
- Coordinate with external or third-party FA laboratories for advanced techniques.
- Review assigned failure analysis cases and request additional information as needed.
- Review historical data for relevant insights.
- Perform initial analysis and define the next appropriate analysis steps.
- Provide regular FA updates and timelines to customers.
- Ensure FA reports are released on time based on target average cycle time.
- Train, mentor, and assist new hires, FA Engineers, technicians, and inspectors.
- Act as the FA focal person for advanced tools and equipment, including 5S, improvements, and coordination with the FAREL Equipment group.
- Generate comprehensive failure analysis reports based on findings.
- Support Environmental Management Systems and Quality Management Systems standards.
- Observe safety and housekeeping practices during all activities.
- Develop and implement new failure analysis methods.
- Become an expert in at least two or more fields such as specific product device families or die and package technologies.
What We're Looking For
- A Bachelor's or Master's degree in Electronics Engineering, Electrical Engineering, or Physics with a semiconductor focus.
- Strong knowledge and experience in electronic/electrical circuit and material analysis.
- Ability to extract, analyze, and report data effectively.
- Computer literacy in MS Word, PowerPoint, and Excel.
- Ability to communicate and coordinate across all organizational levels and functions as a team player with minimal supervision.
- Strong knowledge of inspection and analysis tools and methods for semiconductor components in both package and die form.
- Strong interpersonal and communication skills, both verbal and written.
Nice to Have
- One (1) year of relevant experience in a semiconductor or electronics manufacturing environment, with work experience in Quality and Reliability, Failure Analysis, or Product or Process Engineering.
Technical Stack
- Non-destructive tools: X-ray, Scanning Acoustic Microscope (SAM), Optical microscopes.
- Electrical analysis: Bench verification tools, ATE datalog.
- Fault isolation: Photo Emission Microscope (PEM), Thermal Emission/Hotspot Analysis, Optical Beam-Induced Resistance Change (OBIRCH), Die level microprobing.
- Deliding/Delayering: Chemical and laser decapsulation, Chemical etch, Dry etch, Mechanical polishing.
- Advanced analysis: SEM/EDX analysis.
Team & Environment
You will work with fellow engineers both locally and with Failure Analysis engineering counterparts from other Microchip sites. The role requires close collaboration with different cross-functional teams.
Work Mode
This is an onsite position.
Microchip Technology Inc. is an equal opportunity employer.
