What You'll Do
Take ownership of package design for AI-focused High Density Power Modules, ensuring performance and reliability in demanding computing environments. Translate system requirements into physical designs and deliver detailed 3D models for production.
Conduct mechanical and thermal simulations to predict warpage, stress, and thermal behavior under operational conditions. Refine models based on test data and support correlation between simulation and real-world performance.
Prepare comprehensive reports on simulation outcomes and test results for both internal teams and external partners. Develop test strategies and lead mechanical validation efforts to confirm design integrity.
Partner with manufacturing teams—both internal and external—to transition prototypes into volume production. Provide direct technical support during prototyping and early manufacturing phases, addressing design and process challenges as they arise.
Requirements
- Proven understanding of materials science as applied to semiconductor packaging
- Experience with manufacturing processes specific to advanced packaging technologies
- Ability to create and interpret 3D mechanical designs and simulation data
- Strong communication skills for cross-functional collaboration across engineering and production teams
Benefits
This role supports a high-impact product line in a growing technology domain, offering direct involvement in the development of next-generation power solutions. You’ll work at the intersection of design, simulation, and manufacturing, contributing to products that enable advancements in AI and high-speed networking.
