Shape the future of high-speed connectivity by leading technical development for large-format, fine-pitch sockets in next-generation data systems. In this role, you will define product roadmaps, guide engineering innovation, and ensure alignment between market needs and performance requirements for advanced interconnect solutions.
Key Responsibilities
- Lead end-to-end development of high-speed socket products—from concept and design to validation and production release—ensuring robust performance and manufacturability.
- Translate customer and market input into actionable technical specifications, working closely with cross-functional teams including sales, product management, and system architects.
- Develop and validate 3D models using Creo and perform signal integrity simulations with Ansys HFSS to optimize electrical performance.
- Design and execute prototype testing, lead qualification efforts, and support manufacturing ramp-up with engineering analysis and troubleshooting.
- Collaborate with global engineering teams to standardize design practices and improve simulation methodologies for mechanical and electrical robustness.
- Mentor engineers in advanced design principles and simulation techniques, fostering technical growth across the organization.
- Engage directly with customers during early development phases to co-create solutions that meet future technology roadmaps.
- Present technical proposals and engineering evaluations, aligning product capabilities with application-specific requirements.
Qualifications and Skills
- Bachelor’s degree in Mechanical or Mechatronics Engineering with at least 5 years of experience in high-speed interconnect design.
- Proven experience in mechanical design using Creo or SolidWorks and signal integrity analysis with Ansys HFSS or Keysight ADS.
- Strong ability to interpret simulation and test data, diagnose performance issues, and deliver effective solutions.
- Experience supporting customers directly, working alongside field engineers to refine designs and resolve technical challenges.
- Fluency in English and ability to collaborate effectively in a global, cross-functional environment.
- Self-driven, adaptable, and capable of leading technical projects independently.
Preferred Background
- Master’s degree in a relevant engineering discipline.
- Knowledge of high-speed signal integrity principles and compliance with PCIe Gen 6/7 standards.
- Experience with server, switch, or memory interconnects and familiarity with semiconductor packaging and test methodologies.
- Exposure to Six Sigma or data-driven problem-solving frameworks.
Work Environment
This position supports global collaboration across multiple regions, requiring coordination with engineering, manufacturing, and customer teams worldwide. The role emphasizes technical leadership, innovation, and alignment with long-term market trends in digital data networks.
