Responsibilities
- Support the development, optimization, and maintenance of die bond and wire bond processes to ensure good quality, yield, and reliability
- Assist in troubleshooting process issues and perform root cause analysis for defects, yield loss, or equipment-related problems
- Participate in new product introduction (NPI), process qualification, and transition to mass production
- Help establish and update process parameters, work instructions, and control plans
- Analyze process data using basic statistical tools such as SPC, CPK, and trend analysis
- Work closely with cross-functional teams including Production, Quality, Equipment, and R&D
- Contribute to continuous improvement initiatives to enhance yield, cost efficiency, cycle time, and product reliability
Requirements
- Fresh graduates with a Bachelor’s degree in Engineering (Materials, Mechanical, Manufacturing, or related fields)
- Strong willingness to learn, good problem-solving skills, and a positive teamwork attitude
Nice to Have
- Basic knowledge or exposure to die bonding and wire bonding processes
- Knowledge with QFN (Quad Flat No-Lead) or similar semiconductor packages
- Knowledge of DOE (Design of Experiments) methods
- Interest in yield improvement, reliability testing, and failure analysis
- Exposure to automation, equipment setup, or process optimization through academic projects or internships
- Basic programming knowledge in C, C++ or Python
Work Arrangement
Hybrid
Additional Information
- The designated in-office days are Tuesday through Thursday for innovation, collaboration and continuous learning.
