Responsibilities
- Develop assembly and interconnection technologies for printed circuit board-based electronic control units
- Define mechanical and thermal load limits for solder joints
- Characterize materials and describe lifetime behavior of interconnection technologies in electronic modules
- Design and assess experimental test setups
- Produce technical reports in English and present findings to development teams
- Apply big data techniques to enhance development speed and accuracy
- Collaborate with cross-functional engineering teams across locations, including international partners
- Lead technical coordination of reliability tasks such as simulations, testing, and failure analysis
- Establish reliability targets with customers and provide regular updates on project progress
- Utilize project management methodologies including quality, change, and risk control to ensure timely delivery
Work Arrangement
Remote (Country)
Responsibilities (10)
- Development of AIT (assembly and interconnection technologies) for PCB (Printed Circuit Board) based electronic control units
- Definition of solder joint load capability
- Material characterization and lifetime description of AIT in electronic control units
- Setting up and evaluating experiments
- Creating reports in English and presenting them to project teams
- Usage of big data methods to increase development efficiency
- Work in cross-functional simultaneous engineering teams, with product development teams, both locally and internationally
- Technical coordination of reliability related activities (simulations, tests, analyses)
- Agreement of project targets with customer and regular reporting of project status to customer and management
- Apply project management tools, like quality management, change management, risk management to ensure project success
