Chandler, Arizona Hybrid Full-time

PowerLattice Technologies Inc is hiring a Power Delivery Solution Architect

About the Role

The Power Delivery Solution Architect will lead the technical adoption of PowerLattice’s chiplet-based power delivery network (PDN) solution, acting as a key bridge between internal engineering teams and top-tier customers. You will engage deeply with customer engineering teams on advanced xPU SoC designs, guiding them through the full integration lifecycle while shaping future product enhancements.

What You'll Do

  • Enable customer to design GPU/CPU SoC power solution with PowerLattice’s chiplet
  • Assist customer’s PDN design optimization using PowerLattice’s design kit
  • Gather customer feedback and translate insights into improvements for customer enablement and product development
  • Assist customers through the full adoption lifecycle, from early modeling through physical design and system bring-up
  • Maintain strict confidentiality and handle sensitive technical information with discretion
  • Act as a primary technical point of contact for tier-one customers

What We're Looking For

  • 8+ years of experience in power integrity and/or signal integrity for high-performance SoCs
  • Exceptional proficiency in power integrity or signal integrity tool chain and simulation flow
  • Hands-on experience extracting, building, and validating SoC package electrical models
  • Strong experience with package-level PI/SI, including substrates, interposers, and advanced packaging (2.5D / 3D)
  • Deep proficiency with PI/SI simulation tools and analysis workflows
  • Strong debugging skills across simulation and electrical testing environments
  • Excellent written and verbal communication skills, with the ability to engage directly with customer engineering teams
  • High level of professionalism, discretion, and sound technical judgment
  • Comfortable working independently and proactively solving problems

Nice to Have

  • Working experience at major processor or ASIC companies in the related technical area
  • Proven experience as engineering or project lead in a related technical area
  • Hands-on experience with electrical test methodologies and instrumentation for power integrity or signal integrity
  • Experience in advanced package technologies, e.g. CoWoS, 2.5D

Technical Stack

  • PI/SI simulation tools
  • SoC package electrical modeling tools
  • Power integrity tool chain
  • Signal integrity tool chain
  • Simulation flow environments
  • Electrical test instrumentation

Team & Environment

  • Fast-paced startup environment
  • Proactive problem solving
  • High ownership and impact
  • Customer-focused technical partnership
  • Growth-oriented

Benefits & Compensation

  • Stock option grant
  • Comprehensive benefits package including health, dental, vision, and 401(k)

PowerLattice Technologies Inc offers a base salary range of $180,000 - $250,000, with additional equity through a stock option grant.

Work Mode

This is a hybrid role based in Chandler, AZ (Greater Phoenix) or Vancouver, WA (Greater Portland), requiring 3 days a week onsite. Remote flexibility may be considered for exceptional candidates based in Silicon Valley, CA.

PowerLattice Technologies Inc is an equal opportunity employer. We celebrate diversity and are committed to creating an inclusive environment for all employees.

Required Skills
PI/SI simulationSoC package electrical modelingPower integrity analysisSignal integrity analysisSimulation flow automationElectrical test instrumentationAdvanced packaging (2.5D/3D)Substrate and interposer designHigh-performance SoC power delivery PI/SI simulationSoC package electrical modelingPower integrity analysisSignal integrity analysisSimulation flow automationElectrical test instrumentationAdvanced packaging (2.5D/3D)Substrate and interposer designHigh-performance SoC power delivery
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About company
PowerLattice Technologies Inc
Developing a groundbreaking chiplet solution for a fundamental shift in how high-performance chips are powered, paving the way for the next generation of AI and advanced computing. First to offer a tiny device that can be integrated into a SoC package.
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Job Details
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Posted 2 months ago