Responsibilities
- Drive the strategic direction for thermal-mechanical simulation technologies.
- Establish methods for Physics AI to enhance and accelerate conventional finite element and multi-physics analysis, delivering instant reliability feedback.
- Develop comprehensive simulation pipelines that tackle intricate 3D integrated circuit challenges such as through-silicon via stress, micro-bump durability, and overall package deformation.
- Serve as the principal technical liaison to top-tier semiconductor firms, showcasing how rapid computation reduces design iteration times from days to minutes.
- Shape the evolution of GPU-powered solvers by guiding their optimization for nonlinear material responses and multi-scale mesh requirements in advanced packaging.
- Build, guide, and manage a skilled team of engineers focused on computational mechanics and artificial intelligence in physical modeling.
Team
You will lead a new division focused on 3D-IC Thermal-Mechanical Reliability and build a team of engineers specialized in computational mechanics and AI-driven physics.
