Responsibilities
- Determine optimal approaches for adapting advanced solver technology to address thermal management challenges in semiconductor systems.
- Serve as the principal technical authority on chip cooling solutions, aligning software development with hardware design requirements.
- Collaborate directly with leading semiconductor manufacturers and large-scale data center operators to resolve intricate thermal performance issues.
- Showcase the speed and accuracy advantages of rapid-cycle simulation platforms compared to traditional computational fluid dynamics methods.
- Build and guide a specialized team focused on thermal applications to expand technical support in the semiconductor sector.
Responsibilities
- Define how Flexcompute’s solver technology can be optimized for thermal management, including microfluidics, phase-change materials, and 3D IC packaging.
- Act as the primary subject matter expert (SME) for chip cooling, bridging the gap between our internal solver developers and external hardware architects.
- Work directly with Tier 1 semiconductor companies and Hyperscalers to solve complex thermal challenges using Flexcompute’s simulation platform.
- Demonstrate the superiority of our fast-cycle simulation over legacy CFD tools to industry leaders at Nvidia, Intel, TSMC, and cooling specialists.
- Eventually recruit and mentor a team of thermal application engineers to support our growing portfolio in the semiconductor space.
