Responsibilities
- Lead the review of schematic design and PCB layout for Ethernet/Wireless Communication products, with a specific focus on PDU and UPS applications.
- Work closely with Mechanical Engineers on stacking reviews and with RF Engineers to optimize radio performance.
- Collaborate with SI (Signal Integrity) and DQA teams to qualify features and ensure mass production readiness.
- Conduct rigorous design reviews, including component derating analysis.
- Propose design updates to optimize for DFM (Manufacturing), DFA (Assembly), and DFC (Cost).
- Manage schematic and BOM maintenance throughout the product lifecycle.
- Develop comprehensive test plans, execute validation tests (including signal quality and functional capability), and document the results.
- Perform teardowns and competitive analysis of new products in the market to stay ahead of industry trends.
Requirements
- Experience designing with RISC, Arm-based SoC, or Arm-based MCU is required.
- 3+ years of experience bringing products to Mass Production (MP), with a specific focus on SNMP Cards or the Ethernet/Wireless communication of PDU, UPS, or EV products.
- Familiarity with hardware design requirements for systems running RTOS or Linux.
- Proficient in OrCad Capture CIS, Power PCB, and Allegro.
- Deep understanding of electronic components (R/L/C, MOSFETs, BJTs, Logic ICs, Sensors) and battery applications (e.g., Li-ion rechargeable batteries).
- Strong knowledge of ESD, EMI, Surge protection, and Hi-Pot testing standards.
- Hands-on experience using oscilloscopes and logic analyzers for hardware debugging.
- Understanding of thermal solutions and heat dissipation design.
Nice to Have
- Strong willingness to learn and adapt to different development platforms and architectures.
- Experience leading technical projects or mentoring junior engineers.
- Aggressive in problem-solving, open-minded, and positive.
- Familiarity with basic network configuration.
- Familiarity with TDR and Network Analyzers.
